Cooling Element

DEFINITION OF THE PROJECT

• Minimization of pressure loss and assurance of consistent cooling of electronics
  (no temperature gradients)

CALCULATION

• Determination of pressure loss and heat balance

RESULTS

• Sealing of the gap between partition and cover
• Flow through the complete cooling module
  (no bypass flow across partition)
• Abandonment of some cooling rhombs
• Reduction of pressure losses with sufficient cooling

By courtesy of Conti Temic microelectronic GmbH, Nürnberg