Thermal Analysis of Electronic Components

A frequent cause of failure in electronic components is thermal overload. Many devices are getting smaller and smaller, the components are located closer and closer to each other, which means that the heat generated must be efficiently dissipated from the device.

Task / Calculation

  • Thermal design of electronic components
  • Optimization of the cooling
  • Derivation of heat

Images

Contact our engineering office:

Stefan Merkle

Schau mal,

ich habe folgenden interessanten Beitrag bei Merkle & Partner GbR gefunden.
Share on xing
Share on linkedin
Share on twitter
Share on email
Share on facebook
Share on whatsapp

Newsletter

Ja, ich möchte mehr wissen über interessante Themen bei Merkle & Partner GbR. Bitte schicken Sie mir zukünftig den Newsletter.
Newsletter Anmeldung

Look,

I found the following interesting post at Merkle & Partner GbR

Share on xing
Share on linkedin
Share on twitter
Share on email
Share on facebook
Share on whatsapp

Newsletter

Yes, I would like to know more about interesting topics at Merkle & Partner GbR. Please send me the newsletter in the future.

Newsletter Sign up