With new developments, more and more functions are hosted in an increasingly confined space. The computing power of the Apollo 11 space shuttle is far exceeded by any smartphone today.
More power in an ever smaller space leads to higher temperatures if more heat cannot be released to the environment at the same time. The tolerable temperatures are limited.
If the temperature is too high, components fail, become leaky, deform too much and fires occur. The dissipation of heat through heat conduction, free convection, forced convection and radiation is physics.
We simulate the physics, display the temperatures and lateral temperature curves in 3D on your components. We show you how thermal management can be optimized in a targeted manner.
We will give you suggestions for optimization and precise steps on what you can do so that your designs do what they are supposed to and so that there are no expensive surprises later.
Electric hand tools are becoming ever more compact and powerful
More and more electronic components are installed on computer boards. The power losses are getting bigger. Power losses in a rack are already in a range up to 30 kW.
High-performance motors need good thermal management, otherwise they will overheat. There is only limited cooling air in vehicles
© 2020 MERKLE & PARTNER GbR – All rights reserved.