In new developments, more and more functions are packed into ever tighter spaces. The computing power of the Apollo 11 space shuttle is far surpassed by any smartphone today.

More power in ever smaller spaces leads to ever higher temperatures if more heat cannot be released into the environment at the same time. However, the tolerable temperatures are limited.

If the temperature is too high, components fail, leak, cause fires, deform too much. The dissipation of heat by conduction, free convection, forced convection and radiation is physics.
We simulate the physics, display the temperatures and lateral temperature curves 3D on your components. We show you how thermal management can be optimized in a targeted manner. From us you get optimization suggestions and exact steps what you can do, so that your developments do what they should and there are no expensive surprises later.

[Translate to English:] Merkle Partner zu heiss

Electric hand tools are becoming more and more compact and powerful. More and more electronic components are being installed on computer boards. The power losses are becoming ever greater. Power losses in a rack are already in the range of up to 30 kW. High-performance motors need good thermal management, otherwise they overheat. Cooling air in vehicles is only available to a limited extent